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metallurgical laboratory techniques

Hot-sale Bench-Top Double Side Lapping/ Polishing Machinefor Max. 2" wafer

Product Description
TN-EQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can
lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one
micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter.It is widely used in domestic and foreign university laboratories, research institutes and enterprise laboratories ideal equipment.

Specifications

Lapping Plate Dimensions

225 x 94 x 15mm (Outer dia. x Arbor dia. x Thickness)

Weight of Upper Lapping Plate and Balance

5.5kg (3kg for balance weight)

Gearing Template Specification

z=54 m=1.5 dia.81mm (metric)

Number of Gearing Templatesfor Simultaneous Use

4

Largest Work Piece Size

Dia. 60mm; thickness 15mm

Accuracy of Fatnessand Parallelism

0.001mm

Accuracy of Lapping and Polishing

+/-0.001mm

Surface Finish

>grade 10

Input Power

Single phase 220V

Motor

DC/600W

Dimensions

615x375x494mm

Net Weight

80kg

Compliance

CE certified