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Automatic metallographic grinding and polishing

15 inches Automatic Lapping and Polishing Equipment for Preparing Metallographic Samples

Product Description

TN-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three workstations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples.

Specifications:

Voltage

AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.

Power

400W

Two Super Flat Lapping Plate

Flatness< 0.25 micron / Inch²

Precision Rotating Shaft

Running off < 5 micron

Features

One castiron plate for lapping and one cast aluminum plate for polishing

Heavy duty cast aluminum case with bright painting

Three rocking workstations with wafer holders and condition rings.

Theycan be controlled independently for polishing 3 pcs of 4" wafersor 9 pcs of 2" wafers in one running

Adjustable Timer for Auto-stop

0~99 hours

Variable Speed

0to 125 RPM with digital display

Dimension

720L *580W *380H mm

Compliance

CE Certified

Automatic Slurry Feeder

Oneautomatic slurry feeder SKZD-2 is included.

The plastic rolling containercan take the volume of slurry up to1.0Gallon (~3.8L) for long time polishing.

Warranty

One year limited warranty with lifetime support

Rusting and damage due to improper storage condition or maintenance are not covered by warranty