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TN-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three workstations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples.
Specifications:
|
Voltage |
AC 110V and 208-240V (50/60Hz) switchable for worldwide operation. |
|
Power |
400W |
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Two Super Flat Lapping Plate |
Flatness< 0.25 micron / Inch² |
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Precision Rotating Shaft |
Running off < 5 micron |
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Features |
One castiron plate for lapping and one cast aluminum plate for polishing Heavy duty cast aluminum case with bright painting Three rocking workstations with wafer holders and condition rings. Theycan be controlled independently for polishing 3 pcs of 4" wafersor 9 pcs of 2" wafers in one running |
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Adjustable Timer for Auto-stop |
0~99 hours |
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Variable Speed |
0to 125 RPM with digital display |
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Dimension |
720L *580W *380H mm |
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Compliance |
CE Certified |
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Automatic Slurry Feeder |
Oneautomatic slurry feeder SKZD-2 is included. The plastic rolling containercan take the volume of slurry up to1.0Gallon (~3.8L) for long time polishing. |
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Warranty |
One year limited warranty with lifetime support Rusting and damage due to improper storage condition or maintenance are not covered by warranty |
Contact: Jack
Phone:
Tel: 008657985743654728
Email: [email protected]
Add: No.96,Bingwang Road Street,Yiwu City Zhejiang province CHINA